may 2011 doc id 15671 rev 5 1/7 7 stps30120djf power schottky rectifier features very small conduction losses negligible switching losses extremely fast switching low forward voltage drop low thermal resistance high avalanche capability specified ecopack ? 2 compliant component description schottky rectifier suited for switch mode power supply and high frequency dc to dc converters. packaged in powerflat?, this device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. tm: powerflat is a trademark of stmicroelectronics table 1. device summary symbol value i f(av) 30 a v rrm 120 v t j (max) 150 c v f (typ) 0.61 v k a a a k k a powerflat 5x6 stps30120djf www.st.com
characteristics stps30120djf 2/7 doc id 15671 rev 5 1 characteristics to evaluate the conduction losses use the following equation: p = 0.61 x i f(av) + 0.005 i f 2 (rms) table 2. absolute ratings (limiting values, anode terminals short circuited) symbol parameter value unit v rrm repetitive peak reverse voltage 120 v i f(rms) forward rms current 45 a i f(av) average forward current t c = 80 c, = 0.5 30 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 200 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 12500 w t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 1. condition to avoid thermal r unaway for a diode on its own heatsink 150 c table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case 2.5 c/w table 4. static electrical characteristics (anode terminals short circuited) symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: tp = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm 35 a t j = 125 c 5.5 16 ma v f (1) forward voltage drop t j = 25 c i f = 15 a 0.84 v t j = 125 c 0.61 0.67 t j = 25 c i f = 30 a 0.92 t j = 125 c 0.68 0.75 dptot dtj < 1 rth(j-a)
stps30120djf characteristics doc id 15671 rev 5 3/7 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) p f(av) (w) 0.0 5.0 10.0 15.0 20.0 25.0 30.0 0 5 10 15 20 25 30 35 40 =0.05 =0.1 =0.2 =0.5 =1 t =tp/t tp i f(av) (a) i f(av) (a) 0 5 10 15 20 25 30 35 0 25 50 75 100 125 150 r th(j-a) =r th(j-c) t =tp/t tp t amb (c) figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p p (25c) arm (tj) arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values) figure 6. relative variation of thermal impedance, junction to case, versus pulse duration i m (a) 0 20 40 60 80 100 120 140 160 180 200 1.e-03 1.e-02 1.e-01 1.e+00 t c =25c t c =75c t c =125c i m t =0.5 t(s) z th(j-c) /r th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse tp(s)
characteristics stps30120djf 4/7 doc id 15671 rev 5 figure 7. reverse leakage current versus reverse voltage applied (typical values) figure 8. junction capacitance versus reverse voltage applied (typical values) i r (ma) 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 102030405060708090100110120 t j =150c t j =125c t j =25c t j =100c t j =75c t j =50c v r (v) c(pf) 100 1000 10000 11 0 1 00 1 000 f=1mhz v osc =30mv rms t j =25c v r (v) figure 9. forward voltage drop versus forward current figure 10. thermal resistance junction to ambient versus copper surface under tab i fm (a) 0 5 10 15 20 25 30 35 40 45 50 55 60 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 t j =25c (maximum values) t j =125c (maximum values) t j =125c (maximum values) t j =125c (typical values) t j =125c (typical values) v fm (v) 0 50 100 150 200 250 012345678910 r th(j-a) (c/w) s cu (cm2) epoxy printed circuit board fr4, copper thickness = 35 m
stps30120djf package information doc id 15671 rev 5 5/7 2 package information epoxy meets ul94,v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. footprint (dimensions in mm) table 5. powerflat 5x6 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.80 1.00 0.031 0.039 a1 0.02 0.05 0.001 0.002 a2 0.25 0.010 b 0.30 0.50 0.012 0.020 d 5.20 0.205 d2 4.11 4.31 0.162 0.170 e 1.27 0.050 e 6.15 0.242 e2 3.50 3.70 0.138 0.146 l 0.50 0.80 0.020 0.031 k 1.275 1.575 0.050 0.062 d2 e2 k l b e d e a a1 a2 1.27 0.62 0.95 0.98 6.29 4.33 3.86 5.35 4.41
ordering information stps30120djf 6/7 doc id 15671 rev 5 figure 12. tape and reel specifications 3 ordering information 4 revision history dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 8.0 6.30 2.0 12.0 5.30 1.75 5.5 ? 1.55 ? 1.5 0.20 1.20 0.30 r 0.50 table 6. ordering information order code marking package weight base qty delivery mode STPS30120DJF-TR ps30 120 powerflat 5x6 0.095 g 3000 tape and reel table 7. document revision history date revision changes 18-may-2009 1 first issue. 09-nov-2009 2 updated table 1. 25-feb-2010 3 corrected order code and marking in ta b l e 6 . 30-jul-2010 4 replace power qfn with powerflat. 20-may-2011 5 updated package graphics. added mention of terminals to captions of ta b l e 2 and ta bl e 4 . updated base quantity and marking in ta bl e 6 . added figure 12.
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